ENDEFR
Home › Japan › Japan Advanced Semiconductor Manufacturing株式会社

Japan Advanced Semiconductor Manufacturing株式会社

株式会社 (株) · 熊本, Japan · LEI 2549002MWO92G69ZKH89
LEI active

Summary

Japan Advanced Semiconductor Manufacturing株式会社 is registered in Japan and entered in the “Companies Registration” under number 3300-01-029277. Its legal form is 株式会社 (株) – joint-stock company (Japan). According to GLEIF, its ultimate parent is 台灣積體電路製造股份有限公司 (Taiwan), which is also its direct parent. That group has 2 subsidiaries with LEIs in 3 countries, 1 of them in Japan. The LEI was first issued on 8 Jan 2024 and the record was last updated on 5 Feb 2026; the next renewal is due by 10 Feb 2027.

Written from GLEIF data using fixed, reviewed sentence templates.

Data-quality notes (AssetCensus analysis)

No data-quality notes for this entity in this data release.

Company details

Legal form株式会社 (株)
joint-stock company (Japan)
RegisterCompanies Registration · Register website
Registration number3300-01-029277
Registration authorityLegal Affairs Bureau
JurisdictionJapan
Registered address県菊池郡菊陽町大字原水4106番地1, 869-1102 熊本, Japan
Headquarters address8, Li-Hsin Rd. 6, Hsinchu Science Park, 300096 Hsinchu, Taiwan
Categorycompany or other legal entity
Statusactive
Founded (per GLEIF)10 Dec 2021
LEI2549002MWO92G69ZKH89
LEI statusactive
LEI first issued8 Jan 2024
LEI record last updated5 Feb 2026
Next LEI renewal10 Feb 2027
Corroboration of the LEI recordfully corroborated

Group membership

台灣積體電路製造股份有限公司 Taiwan ultimate parent
Japan Advanced Semiconductor Manufacturing株式会社 this entity
View the whole group: 2 subsidiaries in 3 countries

Relationship to the parent

Direct parentUltimate parent
Parent台灣積體電路製造股份有限公司台灣積體電路製造股份有限公司
Accounting period1 Jan 2025 to 31 Dec 20251 Jan 2025 to 31 Dec 2025
Evidenceother official documentsother official documents
Corroborationsupplied by the entity onlysupplied by the entity only
Consolidation percentage reported to GLEIF73.00%73.00%
Relationship start10 Dec 202110 Dec 2021
Recorded at GLEIF since8 Jan 20248 Jan 2024
Last updated5 Feb 20265 Feb 2026
Record statuscurrentcurrent

Other subsidiaries of the same direct parent (1)