GlobalWafers Singapore Pte. Ltd.
Private Company Limited by Shares · Singapore, Singapore · LEI 549300Z4BF55H8HACD60
LEI lapsed
Summary
GlobalWafers Singapore Pte. Ltd. is registered in Singapore and entered in the “Business Registry (ACRA)” under number 201334164H. Its legal form is Private Company Limited by Shares. According to GLEIF, its ultimate parent is 中美矽晶製品股份有限公司 (Taiwan). That group has 3 subsidiaries with LEIs in 3 countries, 1 of them in Singapore. The LEI was first issued on 17 Jun 2014 and the record was last updated on 10 Jul 2026. It has lapsed: renewal was due by 9 Jul 2026. AssetCensus found 3 data-quality notes for this entity (see below).
Written from GLEIF data using fixed, reviewed sentence templates.
Data-quality notes (AssetCensus analysis)
- The LEI has lapsed: it was due for renewal by 9 Jul 2026 and was not renewed, so GLEIF's data for this entity has not been re-verified since. A lapsed LEI does not mean the company has ceased to exist.
- The ultimate-parent link rests on accounts for the period ending 31 Dec 2022, more than 24 months before this data release. The group may have changed since.
- The ultimate-parent relationship record was not renewed; it was last updated on 10 Jul 2026.
Company details
| Legal form | Private Company Limited by Shares |
|---|---|
| Register | Business Registry (ACRA) · Register website |
| Registration number | 201334164H |
| Registration authority | Accounting and Corporate Regulatory Authority (ACRA) |
| Jurisdiction | Singapore |
| Registered address | 9 Straits View, #06-07, 018937 Singapore, Singapore |
| Headquarters address | No. 8, 300096 Hsinchu, Taiwan |
| Category | company or other legal entity |
| Status | active |
| Founded (per GLEIF) | 20 Dec 2013 |
| LEI | 549300Z4BF55H8HACD60 |
| LEI status | lapsed |
| LEI first issued | 17 Jun 2014 |
| LEI record last updated | 10 Jul 2026 |
| Next LEI renewal | 9 Jul 2026 |
| Corroboration of the LEI record | fully corroborated |
Group membership
GlobalWafers Singapore Pte. Ltd. this entity
Relationship to the parent
| Ultimate parent | |
|---|---|
| Parent | 中美矽晶製品股份有限公司 |
| Accounting period | 1 Jan 2022 to 31 Dec 2022 |
| Evidence | other official documents |
| Corroboration | supplied by the entity only |
| Relationship start | 2 Dec 2016 |
| Recorded at GLEIF since | 2 Aug 2022 |
| Last updated | 10 Jul 2026 |
| Record status | not renewed |
Parent not reported to GLEIF
- Direct parent: the parent has no LEI and has not consented to obtain one.
Other names
- Sunedison Semiconductor Pte. Ltd. · previous name