環球晶圓股份有限公司
股份有限公司 · Hsinchu, Taiwan · LEI 529900V6RTNF3U5EGX67
LEI active
Summary
環球晶圓股份有限公司 is registered in Taiwan. Its legal form is 股份有限公司. According to GLEIF, its ultimate parent is 中美矽晶製品股份有限公司 (Taiwan), which is also its direct parent. That group has 3 subsidiaries with LEIs in 3 countries, 1 of them in Taiwan. The LEI was first issued on 27 Oct 2017 and the record was last updated on 26 Jun 2026; the next renewal is due by 8 Jul 2027. GLEIF's ISIN mapping lists 2 ISINs for this LEI.
Written from GLEIF data using fixed, reviewed sentence templates.
Data-quality notes (AssetCensus analysis)
No data-quality notes for this entity in this data release.
Company details
| Legal form | 股份有限公司 |
|---|---|
| Register | · Register website |
| Registration number | 28113286 |
| Registration authority | Ministry of Economic Affairs |
| Jurisdiction | Taiwan |
| Registered address | No. 8, Gongye E. 2nd Rd., East Dist., 300091 Hsinchu, Taiwan |
| Category | company or other legal entity |
| Status | active |
| Founded (per GLEIF) | 18 Oct 2011 |
| LEI | 529900V6RTNF3U5EGX67 |
| LEI status | active |
| LEI first issued | 27 Oct 2017 |
| LEI record last updated | 26 Jun 2026 |
| Next LEI renewal | 8 Jul 2027 |
| Corroboration of the LEI record | fully corroborated |
Group membership
環球晶圓股份有限公司 this entity
Relationship to the parent
| Direct parent | Ultimate parent | |
|---|---|---|
| Parent | 中美矽晶製品股份有限公司 | 中美矽晶製品股份有限公司 |
| Accounting period | 1 Jan 2025 to 31 Dec 2025 | 1 Jan 2025 to 31 Dec 2025 |
| Evidence | consolidated accounts | consolidated accounts |
| Corroboration | fully corroborated | fully corroborated |
| Relationship start | 30 Oct 2019 | 30 Oct 2019 |
| Recorded at GLEIF since | 30 Oct 2019 | 30 Oct 2019 |
| Last updated | 26 Jun 2026 | 26 Jun 2026 |
| Record status | current | current |
Other subsidiaries of the same direct parent (1)
ISINs mapped to this LEI (2)
US37891E1038 · US37891E2028
2 in the GLEIF–ANNA mapping file. The file covers ISINs issued since the mapping started, not all securities.
Other names
- GlobalWafers Co. Ltd. · previous name
- GlobalWafers Co. Ltd. · name in another language
History
26 Jun 2026Headquarters address changed
26 Jun 2026Registered address changed
8 Jul 2025Legal name changed
23 Nov 2023Legal form changed
10 Dec 2022Headquarters address changed